Publication Opportunity: The abstracts of all accepted papers will be published in the Conference Abstract Book with an ISBN Number. Full papers will have publication opportunities in various indexed international journals, including SCOPUS, Web of Science, UGC Care, and many more, or as a Book Chapter.

The World Conference on NextGen Aerospace Innovation, Mechanical Engineering & Advanced Manufacturing will be held on 29th - 30th Oct 2026 in Yangon,Myanmar, bringing together researchers, academicians, industry professionals, innovators, policymakers, and students from around the world to discuss the latest developments, emerging trends, and future opportunities in the field.
This conference focuses on emerging innovations in aerospace engineering, advanced manufacturing, smart production systems, mechanical design, sustainable engineering, and next-generation industrial technologies. The event encourages the exchange of knowledge and research that drives technological advancement and industrial transformation.
Publication Opportunities & Recognition: Selected papers presented at the conference will be considered for publication in Scopus-indexed, Web of Science, Google Scholar-indexed journals, conference proceedings, edited books, and book chapters, subject to peer review, editorial policies, and publication requirements. Additional publication charges may apply for certain journals, book chapters, or special publication tracks. The conference proudly recognizes and honors distinguished speakers, researchers, academicians, and innovators for their outstanding contributions to research excellence, knowledge advancement, and global academic development.

Publication Opportunity in Scopus Indexed Journals (*)

This Conference is organized by International Academy of Science, Technology, Engineering and Management. The conference will feature a large number of invited lectures from renowned speakers across the country. Best Paper Awards will be presented to papers judged to have made the most significant contribution to the conference.